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PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
1-Nov-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C)
Device Marking
(4/5)
Samples
LM89-1CIMM
LM89-1CIMM/NOPB
NRND
ACTIVE
VSSOP
VSSOP
DGK
DGK
8
8
1000
1000
TBD
Green (RoHS
Call TI
CU SN
Call TI
Level-1-260C-UNLIM
0 to 125
0 to 125
T19C
T19C
& no Sb/Br)
LM89-1CIMMX/NOPB
ACTIVE
VSSOP
DGK
8
3500
Green (RoHS
CU SN
Level-1-260C-UNLIM
0 to 125
T19C
& no Sb/Br)
LM89CIMM/NOPB
ACTIVE
VSSOP
DGK
8
1000
Green (RoHS
CU SN
Level-1-260C-UNLIM
0 to 125
T15C
& no Sb/Br)
LM89CIMMX/NOPB
ACTIVE
VSSOP
DGK
8
3500
Green (RoHS
CU SN
Level-1-260C-UNLIM
0 to 125
T15C
& no Sb/Br)
LM89CIMX
NRND
SOIC
D
8
2500
TBD
Call TI
Call TI
0 to 125
LM89
CIM
LM89CIMX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
SN | CU SN
Level-1-260C-UNLIM
0 to 125
LM89
& no Sb/Br)
CIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
(4)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
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